- 기준카테고리 : Tem-grid
제품설명
상세정보
It is mainly suitable for bonding strip-shaped block samples as a carrier, and TEM observation after ion thinning or double spraying. Such as: the growth of silicon wafers and the adhesion of thin films, observe the cross-section.
Material: copper, nickel, molybdenum, aluminum, tungsten, stainless steel

Material: copper, nickel, molybdenum, aluminum, tungsten, stainless steel



